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Atomic layer etching : ウィキペディア英語版
Atomic layer etching
Atomic layer etching is an emerging technique in semiconductor manufacture, in which a sequence alternating between self-limiting chemical modification steps which affect only the top atomic layers of the wafer, and etching steps which remove only the chemically-modified areas, allows the removal of individual atomic layers. The standard example is etching of silicon by alternating reaction with chlorine and etching with argon ions.
This is a better-controlled process than reactive ion etching, though the issue with commercial use of it has been throughput; sophisticated gas handling is required, and removal rates of one atomic layer per second are around the state of the art.〔(【引用サイトリンク】 title=Atomic Layer Etch now in Fab Evaluations )
The equivalent process for depositing material is atomic layer deposition; this is substantially more mature, having been used by Intel for high-κ dielectric layers since 2007.
== References ==


抄文引用元・出典: フリー百科事典『 ウィキペディア(Wikipedia)
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